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3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

Name: 3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net
Brand: Hhwj
Price: 391.87 PEN
Availability: InStock

Product ID: 155816460

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Frequently Bought Together

Description

Particle Size:1-10Μm
Usage:Repair For Iphone X
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Particle Size:1-10ΜmUsage:Repair For Iphone X

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TrustScore 4.5 | 7,300+ reviews

Ayesha M.

The product exactly matches the description. Very satisfied with my purchase.

5 days ago

Anjali K.

The product quality is outstanding. Exactly what I needed for my work.

1 month ago

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Trustpilot

TrustScore 4.5 | 7,300+ reviews

Sneha T.

Received my product in pristine condition. Great service overall.

1 month ago

Yusuf A.

Fantastic experience overall. Will recommend to friends and family.

1 month ago

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