🔧 Elevate Your Repair Game!
The BGA Reballing Universal Stencil is a high-quality repair tool designed for precision and versatility. With four pitch sizes (0.3mm, 0.35mm, 0.4mm, and 0.5mm) and made from durable stainless steel, this stencil is perfect for reworking BGA IC chips in modern cell phones. Its compact design allows for easy transport, making it an essential tool for professionals on the go.
A**A
10/10
Excelente
M**.
El stencil se dobla con el calor
El vendedor describe que su producto no se deforma con la temperatura, pero en realidad si se deforma al momento de realizar un reballing.
Trustpilot
1 day ago
1 month ago
