🔧 Elevate Your Repair Game with Precision!
The Universal BGA Reballing Stencil is a high-quality tin mesh solder template designed for efficient IC chip repairs in smartphones. Made from durable stainless steel, it features a range of pitch sizes (0.3mm to 0.5mm) and is lightweight for easy transport. This stencil ensures precise tin implantation, making it an essential tool for professionals in the tech repair industry.
| Manufacturer | Hilitand |
| Part Number | Hilitanducin65e2bs |
| Item Weight | 0.493 ounces |
| Package Dimensions | 6 x 4.5 x 0.01 inches |
| Country of Origin | China |
| Item model number | Hilitanducin65e2bs |
| Material | stainless_steel |
| Batteries Included? | No |
| Batteries Required? | No |
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