UPSIREN 12.8w/mk Thermal Putty for VGA GPU IC Processor Rapid Cooling Thermal Pad Replacement Heat Rejection Putty High Performance (10g)

Descripción

* It cannot be used as a silicone grease on the CPU. High thermal performance, unique full curing heat management solution. This material for electronic assembly will not dry out. * Low viscosity for dispensing applications; This material has good adhesion to heat sinks and can be used for automatic dispensing and stenciling screening. * Perfect for rework and field repairs. Compared to thermal pads, this material can fill the gap completely, and compress better, saving you money. ROHS compliant, halogen free, safe for use in areas where harmful substances are prohibited.